Our expertise extends to a wide variety of applications including the design and development of :
spanning a wide spectrum of process technologies including CMOS, SiGe, GaAs pHEMT and HBT at RF, microwave and mm-wave frequencies.
Peak RF consultants have extensive experience of electrical / EM co-simulation of multi-chip modules and packages, encompassing both bondwire and flip-chip bumped die attach. This modelling work is supported by a wealth of experience correlating simulated results against measured circuit performance, and from data obtained from our RF on-wafer probe station.
Our team employs various circuit simulation software packages, including NI AWR Microwave Office™ (MWO) for RF circuit simulation and chip/PCB layout, AXIEM for planar EM simulation and ANSYS HFSS for full 3D EM simulation, all running on powerful multi-core PCs. We use Aphena Softplot for rapid measurement data capture and have developed Peak RF Full-Circle© - an in-house RF utilities tool.